Tuesday, March 11, 2008

Dynacraft Sdn Bhd

Background

Dynacraft Industries was originally set up in 1974 as a subsidiary of an USA, based multinational company, providing semiconductor lead frame and semiconductor materials support to IC assembly plants in the Pacific region. In January 1996, Dynacraft Industries was acquired by Malaysia Pacific Industries and became part of the Hong Leong Group of companies in Malaysia.

Being one of the largest manufacturers of a wide range of semiconductor lead frames, Dynacraft Industries leads the industry in the design, manufacture and supply of microelectronics packaging solutions to the semiconductor assembly industry. Adopting technology-driven design and manufacturing processes, Dynacraft Industries is confidently poised to provide our valued customers with state of the art products at competitive prices and services.

Key policies

  • Quality – committed to comply with our Quality Management System and any applicable requirement in order to uphold the following principles through teamwork:
    • To meet or exceed our customers’ requirement and expectations
    • To continually improve our processes, services and systems.
    • To gauge our performance by constantly monitoring our quality indicator.
  • Environmental – committed to good and responsible work practices in our processes that will help to preserve our environment from pollution through:

§ Conserving resources within and outside our premises.

§ Acts to comply with all legal and replacing legislations and other requirement that we subscribe to.

§ Reducing, reusing, recycling and replacing consumables used in our manufacturing processes.

§ Employing continual improvement philosophy to meet our environmental objectives and targets.

  • T.P.M – Dynacraft Industries is committed to TPM as an approach to achieve our vision. This will be accomplished through continual improvement that encompasses the participation by all employees to :

§ Encourage equipment ownership through teams

§ Optimize asset utilization

§ Enhance employee safety and job satisfaction

§ Improve product quality, cost and delivery

§ Work towards zero defect

  • Customer service – committed to proactively:

§ Create positive impression

§ Understand customers’ needs

§ Deliver value

§ Make it easy to do business with us

Operation

1) Quality control - Dynacraft manufactures lead frames that conform to the standards of JEDEC and EIAJ package outlines such as MQFP, PLCC, SOIC, MDIP, TQFP, TSSOP, TSOP, SSOP, SOT, MLP (QFN) and CERDIP. We use Statistical Process Control (SPC) to monitor manufacturing operations. These SPC tools are continually maintained and updated by Statistical Engineers in ensuring consistent quality through the organization.

2) Design Engineering - Our CAD/CAM network transmits design data to anywhere in the world, connecting:

  • Our valuable customers to Dynacraft design centers, manufacturing sites and sales team Dynacraft to the supplier / business partner.
  • Dynacraft's experienced engineering team:

§ Take hands on approach to customer service and support.

§ They analyze objective through open communications.

§ They seek and identify potential need.

§ They form a company-customer team to design the process for individualized packing solutions for clear and continuous feedback.

3) Manufacturing - Dynacraft holds various patents for process design. Our multinational manufacturing is based in Penang, Malaysia. We build partnerships with training institutions to upgrade the knowledge of employees on an on-going basis to keep our processes at the peak of performance. Every aspect of our manufacturing is reviewed continuously. We are ISO / TS 16949 certified, affirming our commitment to manufacturing and service excellence.

4) Tooling - Dynacraft lead frame stamping are fabricated with full-carbide cutting components. To minimize the cost of tooling additional pad sizes, many of our tools are built in modular format. Options for grounding, down bonding and thermal improvement can be added easily. One of our core competencies is customized tool building. In the direction of provide high volume output, tight dimensional tolerances, and consistent accuracy and precision, the tool of design must emphasize high speed and multiple formats. Also our component clearances are minimized for optimum cutting definition. Our CAD generates electronic instructions to profile grinding, jig boring and wire EDM machines for accuracy automated component fabrication.

5) Stamping - Operations for precision stamping of lead frames for ceramic and plastic packages are located in Penang, Malaysia locations. Exclusive use of Bruderer punch presses in continuous 24-hour operation ensures optimum manufacturing and product quality at high speeds. The stamp a large range of products from alloy 42 to copper alloys, discrete to high pin count QFPs and CERDIP frames. To meet the challenges of higher pin counts and more complex matrix designs the factory enhances the average press tonnage.

6) Etching - Dynacraft's Penang plant uses the highest technology artwork and semiconductor grade plates (mask) to ensure high precision, accuracy and repeatability products. Besides, our expose machine is also fully automated and self alignment for top and bottom mask. The state of art reel to reel process minimizes handling problem and enhance productivity.

7) Plating and Finishing - Our standard plating process is silver in spots, rings, or dots. They are the leader in nickel-palladium pre-plated lead frame to save our customers cycle time, floor space, and added costs. In our plant, the factory uses both the reel-to-reel method, for quick turns at maximum volume and maximum speed, and the strip-to-strip method, for quick turnaround, and small lots. They are able of plating the highest pin counts on the market. Our tolerances are measured in millionths of an inch. Statistical Process Control (SPC) ensures the ultimate in conformance and repeatability

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